Adata LEGEND 970 2TB (NVMe 2.0 | DRAM Cache) Dual-layer aluminum alloy | Patented active air cooling (SLEG-970-2000GCI)
$468.00
Adata LEGEND 970 2TB (NVMe 2.0 | DRAM Cache) Dual-layer aluminum alloy | Patented active air cooling (SLEG-970-2000GCI)
$468.00
- Capacity: 2TB
- Form Factor: M.2 2280
- NAND Flash: 3D NAND
- Controller: Phison PS5026 E26
- Interface: PCIe Gen5 x4
- Sequential Read (Max): Up to 10,000MB/s
- Sequential Write (Max): Up to 10,000MB/s
- 4KB Random Read IOPS (Max): Up to 1,400K
- 4KB Random Write IOPS (Max): Up to 1,400K
- Warranty: 5-year limited warranty
| Capacity | 2TB |
|---|---|
| Form factor | M.2 2280 |
| NAND Flash | 3D NAND |
| Controller | Phison PS5026 E26 |
| Dimensions (L x W x H) | 80.6 x 24.2 x 17.9mm / 3.17 x 0.95 x 0.7inch |
| Weight | 57.1g / 2.01oz |
| Interface | PCIe Gen5 x4 |
| Sequential Read (Max) | Up to 10,000MB/s* |
| Sequential Write (Max) | Up to 10,000MB/s* |
| 4KB Random Read IOPS(Max) | Up to 1,400K* |
| 4KB Random Write IOPS(Max) | Up to 1,400K* |
| Operating temperature | 0°C – 70°C |
| Storage temperature | -40°C-85°C |
| Shock resistance | 1,500G/0.5ms |
| MTBF | 1,600,000 hours |
| Terabytes Written (TBW) | 1,400TB** |
| Warranty | 5-year limited warranty*** |
| Remark | Important reminder: If the SSD itself has heat sinks, disassembling and removing the heat sink yourself is considered man-made damage and will not be covered by the warranty.
* This product is compatible with the latest Intel and AMD platforms and must be used with a motherboard that supports PCIe 5.0 to achieve optimal performance. Actual performance may vary depending on the hardware and software configurations. * This product is backward compatible with PCIe 4.0 and 3.0. * Test system configuration : M/B : ASUS Z790 STRIX E-Gaming WIFI , CPU: i7-13700K, RAM: 16GBx2 DDR5-5200 ** The value is the minimum amount of terabyte written that could be reached. *** The SSD is based on the TBW or Warranty period. Visit https://www.adata.com/us/support/warranty/ for more details. |
- PCIe Gen5 x4 transmission interface
- Up to 10,000/10,000MB/s sequential read/write speed
- Dual-layer aluminum alloy and fan forms a patented active air cooling system
- Compared with a fanless heat sink, temperatures significantly reduced by 10%
- Surface crystallization improves thermal conductivity
- Operates long-term without slowing down or crashing
- 2000GB capacity
- Supports latest Intel and AMD platforms
- 5-year warranty
Extraordinary Speed
The LEGEND 970 adopts the latest generation PCIe Gen5 x4 transmission interface and complies with the NVMe 2.0 standard to deliver amazing read and write capabilities. The LEGEND 970 also supports the latest Intel and AMD platforms. Whether in dynamic or static output, it always provides full performance.
Unreal Performance
Complete every task in moments. The LEGEND 970 has a sequential read/write speed of 10,000/10,000MB per second, double the speed of PCIe Gen4 SSDs and 6 times faster than Gen3 SSDs, and is fully backward compatible with PCIe 4.0 and 3.0 platforms.
Experts of Patented Heat Dissipation
When high efficiency is required, leave it to the professionals! The LEGEND 970 adopts dual-layer extruded aluminum fins¹ to create a dense air duct to divert hot and cold air. When heat is conducted upward, a built-in micro fan is used to remove thermal energy. This unique “active heat dissipation” design delivers significantly cooler temperatures than a fanless heatsink by 10%².
Surface Crystallization Improve Heat Dissipation
The LEGEND 970’s aluminum alloy fins are treated with surface crystallization, which utilizes its physical properties to increase the overall air contact area and maximize the effectiveness of its air cooling system.
QuiKTIPS : Never Experience Throttling Again
High-speed PCIe 5.0 transmission requires powerful heat dissipation. If heat is not dissipated quickly, data read/writes speeds will be adversely affected and the drive itself crashing is a possibility. The LEGEND 970’s active heat dissipation mechanism withstands high temperature test and can maintain stable performance even during long bouts of high speed operation.
*Heat dissipation data is based on test conditions of an internal laboratory and actual figures may vary due to personal hardware, software, and test environments.
QuiKTIPS : Active Cooling Analysis
How does active cooling work? Active cooling works by using a tightly adhered heat dissipation pad and a metal heat dissipator to transfer heat from the SSD. The double-layered aluminum fins help facilitate the heat transfer process. Additionally, a built-in fan draws cold air from openings on the nameplate and directs it towards the aluminum fins. The hot and cold air meet, and the rotation of the fan quickly expels the heat from both sides of the aluminum fins. This design provides superior heat dissipation compared to fanless heatsinks.
High Quality Memory Components
Strict selection of 232-layer 3D flash memory gives the LEGEND 970 a capacity of up to 2000GB and it utilizes a variety of data protection and correction technologies to increase total bytes written (TBW) and durability to meet various high-load requirements.
Superior Technology
LEGEND 970 leverages the advantages of a SLC cache algorithm and DRAM Cache Buffer while featuring 4K random read/write IOPS up to 1,400K/1,400K, further improving the efficiency of multi-file processing. The LEGEND 970 also adopts a LDPC (Low Density Parity Check Code) error correction mechanism and AES 256-bit high-level encryption technology to ensure the accuracy of data transmission and the security of files.
SSD Toolbox value-added software for real-time status monitoring
SSD Toolbox ensures users utilize the latest Firmware version for the best performance and employs Self-Monitoring, Analysis and Reporting Technology (S.M.A.R.T.) to understand the health and remaining lifespan of SSDs, as well as the current operating temperature and storage capacity, so that users can track of SSD status at any time.
Preview a new era of patented heat dissipation! The LEGEND 970 Gen5 SSD adopts dual-layer aluminum alloy heat dissipation fins and a micro fan to create a comprehensive cooling structure while heatsink surface crystallization treatment improves the heat dissipation mechanism, enabling stable long-term operation.
