MSI B760M Project Zero Motherboard
The MSI B760M Project Zero brings innovation with its back-connect design, simplifying cable management for a clean and professional build. Supporting Intel 14th/13th/12th Gen processors, DDR5 memory, PCIe 5.0, and Wi-Fi 6E, it combines modern aesthetics with solid performance in a compact mATX form factor.
Key Features
- Unique back-connect design for clean cable management
- Supports Intel® Core™ 14th/13th/12th Gen, Pentium® Gold, and Celeron® processors (LGA 1700)
- 4x DDR5 slots, up to 256GB, speeds up to 7800+ MHz (OC)
- 12+1+1 Duet Rail Power System with Core Boost technology
- PCIe 5.0 x16 slot for next-gen graphics cards
- Dual M.2 slots with PCIe 4.0 x4 and SATA support
- Extended Heatsink and M.2 Shield Frozr thermal design
- Realtek® ALC897 Codec with 7.1-channel HD audio and S/PDIF output
- Realtek® 2.5G LAN plus Intel® Wi-Fi 6E & Bluetooth® 5.3
- Mystic Light RGB with extension headers
Technical Specifications
- Chipset: Intel® B760
- CPU Support: Intel® Core™ 14th/13th/12th Gen, Pentium® Gold, Celeron®, LGA 1700
- Memory: 4x DDR5, up to 256GB, 7800+ MHz (OC), Dual Channel, Intel® XMP support
- Graphics Outputs: 1x HDMI™ 2.1 (4K@60Hz HDR), 1x DisplayPort 1.4 (4K@60Hz)
- Expansion Slots: 1x PCIe 5.0 x16 (CPU), 1x PCIe 4.0 x4 (Chipset), 1x PCIe 3.0 x1 (Chipset)
- Storage: 2x M.2 (PCIe 4.0 x4 / SATA), 4x SATA 6Gb/s
- RAID: RAID 0/1/5/10 for SATA devices
- USB (Rear & Front): 4x USB 2.0, 2x USB 5Gbps Type-A, 3x USB 10Gbps Type-A, 1x USB 10Gbps Type-C, 1x USB 20Gbps Type-C
- LAN: Realtek® 2.5Gbps LAN
- Wireless: Intel® Wi-Fi 6E, Bluetooth® 5.3
- Audio: Realtek® ALC897 Codec, 7.1-channel HD Audio, S/PDIF Out
- Internal I/O: Multiple fan headers, RGB/ARGB connectors, TPM 2.0 header, chassis intrusion, thermal sensors
- Debug Tools: 4x EZ Debug LED
- Form Factor: mATX, 243.84 × 243.84 mm
- Operating System: Windows® 11 64-bit, Windows® 10 64-bit
The MSI B760M Project Zero is an ideal choice for builders seeking a stylish, compact motherboard that balances strong gaming performance, modern connectivity, and efficient thermal solutions.





















